Audio-visual / Multimedia Item (26 Nov 2014) | German
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Out of stock
Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping,Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability.
| ISBN: | 9783037959480 |
| Publisher: | Trans Tech Publications Ltd |
| Imprint: | Trans Tech Publications |
| Pub date: | 26 Nov 2014 |
| Language: | German |
| Number of pages: | 130 |
| Weight: | -1g |
| Height: | 142mm |
| Width: | 125mm |
| Spine width: | 10mm |
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